Samsung Develops Advanced Packaging Technology to Achieve a 0.6mm-thick 8-chip Package; Ultra-Thin Memory Stacks for High-Density

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Business Wire, November 3, 2009 Tuesday 2:00 AM GMT


Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, announced today that it has developed the world's thinnest multi-die package, one that measures a mere 0.6mm in height. Designed initially for 32 gigabyte (GB) densities, the new memory package is just half the thickness of a conventional memory package of eight stacked chips (or dies). The advanced packaging technology delivers a 40 percent thinner and lighter memory solution for high-density multimedia handsets and other mobile devices.

"Thin remains the action word in today's mobile environment and we're taking a big step here at Samsung to make higher density memory less than half the thickness of what it was before," said Jim Elliott, vice president, memory marketing, Samsung Semiconductor, Inc.